Product Overview

HDI PCBs (High-Density Interconnect Printed Circuit Boards) yog cov txheej txheem PCB siab heev uas ua tiav siab -kev sib tshuam kev sib txuas los ntawm kev siv micro-vias, dig muag vias, faus vias, thiab siab -txoj kev siv thev naus laus zis.

Piv nrog rau cov txheej txheem multilayer PCBs, HDI PCBs muab cov kab hluav taws xob ntau dua rau ib cheeb tsam, txoj kev luv luv, thiab kev ua haujlwm hluav taws xob zoo dua. Lawv tshwj xeeb tshaj yog haum rau siab -ceev, siab- zaus, thiab cov khoom siv hluav taws xob sib xyaw ua ke.

Hauv cov khoom siv hluav taws xob hloov tau yooj yim thiab siab-kawg cov khoom siv me me, Flexible HDI PCB sib txuas HDI cov qauv nrog cov txheej txheem hloov tau yooj yim, ua kom khoov, folding, thiab cov ntawv thov dynamic thaum tswj siab - qhov sib txuas muaj peev xwm. Lawv tau siv dav hauv cov khoom siv hnav thiab qhov chaw- txwv tsis pub siv.

HDI PCBs tau dhau los ua qhov kev daws teeb meem tseem ceeb rau cov xov tooj smartphones, 5G kev sib txuas lus, cov khoom siv kho mob, thiab cov khoom siv hluav taws xob siab tshaj -.

Khoom nta

Siab -ntaus kev routing muaj peev xwm rau huab miniaturization tsim
Micro- ntawm cov qauv rau kev txhim kho interlayer interconnection efficiency
Txhawb kev dig muag vias, faus vias, thiab stacked ntawm kev tsim
Kev ua tau zoo ntawm cov teeb liab kev ntseeg siab (SI).
Txo cov kab mob parasitic inductance thiab parasitic capacitance
Muaj zog electromagnetic compatibility (EMI / EMC) kev ua tau zoo
Txhawb siab - ceev digital thiab RF sib xyaw tsim
Txhawb nruj - cov qauv flex
Haum rau ultra- nyias, sib xyaw ua ke hauv tshuab hluav taws xob

Daim ntawv thov

Smartphones & Mobile Devices
5G Kev Sib Txuas Lus Module
Consumer Electronics
Cov cuab yeej siv kho mob
Automotive Electronics / ADAS
Wearable Devices
Aerospace Electronics
Industrial High -Speed Control Systems
Flexible Electronics Systems

Product Specifications (Piv txwv)

Yam khoom	Specification
Txheej suav	4–20 khaubncaws sab nraud povtseg (customizable siab dua- txheej HDI qauv muaj)
Khoom siv hauv paus	FR4 / High -Tg FR4 / PI (Flexible HDI PCB)
Board Thickness	0.2-1.6 hli
Yam tsawg kawg nkaus Trace/Space	2/2 mil
Micro- ntawm	0.075-0.1 hli laser drilling
Ntawm Cov Qauv	Dig Muag Via / Buried Via / Stacked Via
Tooj Thickness	0.5-3 oz
Nto tiav	ENIG / ENEPIG / OSP / Immersion Silver
Impedance Tswj	±5%
Ua haujlwm kub	-40℃~ 125℃(nyob ntawm cov khoom siv)

Khoom Zoo vs. Tsob Ntoo Multilayer PCB

Yam khoom	HDI PCBs	Ib txwm Multilayer PCB
Routing Ceev	⭐⭐⭐⭐⭐	⭐⭐
Teeb liab kev ncaj ncees	⭐⭐⭐⭐⭐	⭐⭐
Miniaturization Muaj peev xwm	⭐⭐⭐⭐⭐	⭐⭐
Siab -Frequency Performance	⭐⭐⭐⭐⭐	⭐⭐⭐
EMI Tswj	⭐⭐⭐⭐⭐	⭐⭐
Complex Design Capability	⭐⭐⭐⭐⭐	⭐⭐⭐
Saj zawg zog Expansion muaj peev xwm	⭐⭐⭐⭐ (Flexible HDI PCB zoo dua)	⭐

Summary of Advantages

Txhawb nqa ultra-siab- kev sib txuas ceev ceev thiab tsim qauv me me
Txhim kho siab -ceev teeb liab kis tau tus mob zoo thiab ruaj khov
Tseem ceeb txo cov kab mob parasitic thiab teeb liab poob
Optimizes EMI/EMC kev ua tau zoo rau siab - cov ntawv thov zaus
Txhawb nqa nruj, yoog raws, thiab nruj -cov qauv flex
Ua tau raws li 5G thiab siab -kev ceev cov qauv tsim cov txheej txheem
Txhim kho tag nrho cov kev sib koom ua ke thiab kev ntseeg tau
Haum rau siab -kawg compact electronic khoom tsim

Tom qab -Kev Muag Khoom & Kev Pabcuam

HDI qauv tsim thiab DFM (Design for Manufacturability) txhawb nqa
Micro- ntawm thiab muab tso rau ntawm kev tsim kho kev taw qhia
Siab -cov teeb liab ceev thiab impedance tswj optimization txhawb
Kev xaiv cov khoom siv thiab cov lus pom zoo ntawm cov qauv
Stack- txhawb nqa tsim thiab simulation
Prototyping ceev ceev thiab me me - mus rau - cov kev pab cuam tsim khoom nruab nrab
Kev ntsuam xyuas kev ntseeg tau thiab kev txhawb nqa kev lees paub
Kev xa khoom thoob ntiaj teb thiab kev txhawb nqa saw hlau