Product Overview

HDI Control Circuit Board yog lub siab -kev ua tau zoo multilayer tswj Circuit Court daws tsim raws li High Density Interconnect (HDI) PCB thev naus laus zis. Los ntawm kev siv microvias, qhov muag tsis pom thiab faus vias, thiab nplua - cov txheej txheem routing, nws ua tiav kev sib koom ua ke siab thiab kev ntseeg tau zoo rau cov tshuab hluav taws xob nyuaj.

Hom kab hluav taws xob no ua ke nrog kev tsim PCB siab heev nrog cov txheej txheem SMT sib dhos (PCBA), ua lub hauv paus tseem ceeb rau kev tswj hwm, teeb liab ua, thiab kev tswj fais fab. Nws yog lub chaw tswj xyuas tseem ceeb hauv cov khoom siv hluav taws xob siab niaj hnub no.

HDI Control Circuit Board txhawb nqa 2-theem, 3-theem, lossis ib qho - txheej txheej kev sib txuas. Txawm hais tias muaj kev nce ntau ntxiv, lawv kuj ua kom zoo dua qhov chaw siv thiab txhim kho cov teeb liab kev ncaj ncees, ua rau lawv siv dav hauv kev ua haujlwm siab, compact, thiab high-speed electronic systems.

Khoom nta

High -kev sib tshuam sib txuas (HDI qauv) tsim
Kev them nyiaj yug rau micro vias, dig muag vias, faus vias, thiab laser drilling
Ultra- kab dav dav thiab siab - muaj peev xwm ua tau zoo
Siab- txheej txheej- tsim muaj peev xwm (4–20+ txheej)
Cov teeb liab kev ncaj ncees zoo heev thiab qis - kev sib kis tau zoo
Kev them nyiaj yug rau siab - ceev digital thiab sib xyaw- cov qauv tsim
Txo qhov loj ntawm lub rooj tsavxwm thiab ua rau cov khoom siv me me
Txhim khu kev ntseeg siab thiab stability
Tau tshaj - cov pob khoom ceev xws li BGA thiab QFN
Txhawb nqa nruj -flex thiab complex structural designs

Daim ntawv thov

Consumer Electronics
Smartphones & Tablets
5G Kev sib txuas lus Devices
Automotive Electronic Control Systems
Industrial Control Systems
Kev kho mob Electronics
Aerospace & Defense Electronics
AI Computing Hardware
IoT Smart Devices
Siab -Speed Networking Equipment

Product Specifications (Piv txwv)

Yam khoom	Specification
Txheej	4–20 txheej (txhawb ntau- theem HDI qauv)
Khoom siv hauv paus	FR4 / Siab-Tg FR4 / Rogers (yeem)
Board Thickness	0.4-2.0 hli
Yam tsawg kawg nkaus Trace/Space	2/2 mil
Yam tsawg kawg nkaus qhov taub	0.1 hli (laser microvia)
Qhov muag tsis pom kev / faus ntawm tus qauv	1+N+1 / 2+N+2 / Txhua tus qauv HDI
Tooj Thickness	0.5-3 oz
Nto tiav	ENIG / OSP / HASL / Immersion Silver
Impedance Tswj	±5%
Ua haujlwm kub	-40℃~ 125 degree

Qhov zoo dua piv rau cov tsoos PCB

Yam khoom	HDI Control Board	Ib txwm Multilayer PCB
Routing Ceev	⭐⭐⭐⭐⭐	⭐⭐⭐
Pob Compatibility	⭐⭐⭐⭐⭐	⭐⭐⭐
Teeb liab kev ncaj ncees	⭐⭐⭐⭐⭐	⭐⭐⭐
Miniaturization	⭐⭐⭐⭐⭐	⭐⭐⭐
Siab -Speed Performance	⭐⭐⭐⭐⭐	⭐⭐⭐
Kev them nyiaj yug Structural Complexity	⭐⭐⭐⭐⭐	⭐⭐⭐

Cov ntsiab lus tseem ceeb

Ua kom muaj siab - kev sib cuam tshuam kev sib txuas thiab kev sib txuas hauv Circuit Court
Qhov tseem ceeb txhim kho siab -ceev teeb liab kis tau tus mob
Txhawb cov khoom lag luam miniaturization thiab lub teeb yuag tsim
Txhim khu kev ruaj ntseg thiab tiv thaiv - muaj peev xwm cuam tshuam
Tau tshaj BGA siab heev thiab ultra- cov khoom siv suab zoo
Customizable multi-theem HDI pawg-txoj kev daws teeb meem
Optimizes hluav taws xob kev ua tau zoo thiab thermal tswj
Haum rau siab -kev ua tau zoo hluav taws xob tswj tshuab

Tom qab -Kev Muag Khoom & Kev Pabcuam

HDI pawg- txhawb kev tsim kho kom zoo
DFM/DFT (Design for Manufacturability/Testability) cov kev pab cuam tsom xam
Kev Ntsuam Xyuas Kev Ncaj Ncees (SI) thiab Lub Hwj Chim Kev Ncaj Ncees (PI) kev txhawb nqa
Kev tswj hwm impedance thiab siab - kev taw qhia kev tsim kho kom zoo
Microvia thiab laser drilling txheej txheem txhawb nqa
Ib - nres SMT/PCBA kev tsim khoom
Prototyping ceev ceev thiab me me - mus rau - kev txhawb nqa kev tsim khoom nruab nrab
Kev ntsuam xyuas kev ntseeg siab thiab kev pabcuam kev lees paub zoo
Ntiaj teb no logistics thiab xa khoom txhawb nqa